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NXP Semiconductors
PCU9955
16-channel UFm I 2 C-bus 57 mA constant current LED driver
T j calculation:
T j = T amb + R th(j-a) ? P tot
T j = 50 ? C + (31 ? C/W ? 2.2 W) = 118.2 ? C
This confirms that the junction temperature is below the minimum overtemperature
threshold of 125 ? C, which ensures the device will not go into thermal shutdown under
these conditions.
It is important to mention that the value of the thermal resistance junction-to-ambient
(R th(j-a) ) strongly depends in the PCB design. Therefore, the thermal pad of the device
should be attached to a big enough PCB copper area to ensure proper thermal dissipation
(similar to JEDEC 51 standard). Several thermal vias in the PCB thermal pad should be
used as well to increase the effectiveness of the heat dissipation (e.g., 15 thermal vias).
The thermal vias should be distributed evenly in the PCB thermal pad.
Finally it is important to point out that this calculation should be taken as a reference only
and therefore evaluations should still be performed under the application environment and
conditions to confirm proper system operation.
11. Limiting values
Table 17. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V DD
V I/O
V drv(LED)
I O(LEDn)
I SS
Parameter
supply voltage
voltage on an input/output pin
LED driver voltage
output current on pin LEDn
ground supply current
Conditions
Min
? 0.5
V SS ? 0.5
V SS ? 0.5
-
-
Max
+6.0
5.5
40
65
1.0
Unit
V
V
V
mA
A
I lu
P tot
latch-up current
total power dissipation
JESD
T amb = 25 ? C
[1]
-
-
90
3.2
mA
W
T amb = 85 ? C
-
1.3
W
T stg
storage temperature
? 65
+150
? C
T amb
T j
ambient temperature
junction temperature
operating
? 40
? 40
+85
+125
? C
? C
[1]
Class II, Level B for A1 (pin 3), A2 (pin 4). All other pins are Class II, Level A ( ? 100 mA).
12. Thermal characteristics
Table 18.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
R th(j-a)
thermal resistance from junction to ambient HTSSOP28
[1]
31
? C/W
[1]
Per JEDEC 51 standard for multilayer PCB.
PCU9955
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 2 October 2012
? NXP B.V. 2012. All rights reserved.
28 of 39
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